Innovation、Integration、Solutions - MOS Technology Inc.
|
|
|
|
|
Laser Micro Machining 雷射精微加工系統 |
 |
|
|
 |
| |
| microPRO™ RTP - Selective Laser Annealing System for Semiconductor Applications |
The microPRO™ RTP, a new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing, combines a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor wafer manufacturing platform. It provides selective annealing with high repeatability and throughput in a versatile system.
|
Features:
- Selective in horizontal and vertical direction
- Very high temperature gradients for low thermal budget
- Determined absorption depth by wave length selection
- Excellent energy homogeneity
- Spot can be formed as required
- Dynamic spot motion
- Precise laser and process monitoring
- Various options with pulse length, pulse energy and overlap
|
|
Suited for:
- Magnet Sensor Processing, GMR (Giant magneto resistive) & TMR (Tunneling magneto resistive)
Objective: Formation of monolithic magneto resistive devices with different orientation in one chip
- Configuration for Ohmic Contact Formation (OCF)
Objective:
| - |
Formation of a strong and low ohmic metal interface on backside of a wafer |
| - |
Curing of mechanical damage after thinning process |
Note: SiC devices are getting thinner, flash annealing is no longer an option!
- Dopant Activation by line scan
- Objective: Formation of a field stop layer in IGBT by moving dopants to a well defined position
|
|
|
| |
 |
|
|
|
