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| microPREP™ PRO – High Volume Laser-Based Sample Preparation for Semiconductor and Materials
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Features:
- Innovative novel specimen preparation method
- All beneficial features of first generation kept
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PULS:
- CO2-Snow-Jet technology for in-situ debris removal
- Enlarged working area with piezo driven X-Y-theta stage
- Rotation Toll (“Lathe-tool” fixture)
- Laser micromachining of cylinders at well-defined center of rotation
- Micromachining of arbitrary shapes
- Prepared for correlative workflows
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Suited for:
- Laser cutting and individual sample preparation
- SEM- and micro-analysis
- Sample preparation for micro mechanics (dog-bones or other geometries)
- In-plane and cross section for TEM (based on microPREP XL-Chunk stage)
- X-Ray microscopy
- Pre-shaped APT samples
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